05055378 is referenced by 18 patents and cites 5 patents.

A solder resist composition contains a specified partially acrylated and/or methacrylated bisphenol A novolak epoxy resin component, and a specified partially acrylated and/or methacrylated cresol novolak and/or phenol novolak epoxy resin component. The composition further contain a photopolymerization initiator, a thermosetting agent, an inorganic filler, and an organic solvent. The composition may further include a silane or titanate coupling agent.

Title
Solder resist composition
Application Number
7/269682
Publication Number
5055378
Application Date
November 10, 1988
Publication Date
October 8, 1991
Inventor
Kazuhiro Takeda
Higashine
JP
Yuji Nakaizumi
Kawasaki
JP
Toshiharu Nakagawa
Ayase
JP
Yusuke Wada
Tokyo
JP
Masataka Miyamura
Kamakura
JP
Agent
Oblon Spivak McClelland Maier & Neustadt
Assignee
Kabushiki Kaisha Toshiba
JP
IPC
C08J 3/28
C08F 2/46
G03C 1/73
G03C 1/725
View Original Source