05045971 is referenced by 102 patents and cites 7 patents.

The electronic device housing employs unique temperature management functions. Thermally sensitive electronic components are thermally isolated from the environment and from temperature generating components provided within the housing through the use of an insulative case material. Furthermore, heat generating components are connected to the outside environment with a conductive thermal path which is isolated from the remaining components provided within the case, thereby efficiently transferring undesired heat to the environment without allowing the heat to substantially affect remaining components in the housing. The electronic device housing includes a case and a cover formed by molding using a synthetic resin, and a metallic layer formed on the surface of the case which cooperates with the cover to provide an electromagnetic shield for the case. Further, a waterproof seal is provided in the abutment between the case and the cover and the heat radiating effect of the case is enhanced by a heat radiation plate provided outside the case and connected to any heat generating components. The electronic device of such construction is easy to machine, light in weight and inexpensive.

Title
Electronic device housing with temperature management functions
Application Number
7/376041
Publication Number
5045971
Application Date
July 6, 1989
Publication Date
September 3, 1991
Inventor
Nobuyuki Kakuta
Hyogo
JP
Kunitoshi Yoshitake
Hyogo
JP
Hideyo Ono
Hyogo
JP
Assignee
Mitsubishi Denki Kabushiki Kaisha
JP
IPC
H05K 9/00
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