05043794 is referenced by 47 patents and cites 8 patents.

In accordance with the present invention, an integrated circuit package comprises a thermally conductive plate for receiving an integrated circuit and an open rectangular structure of conductor and insulator for surrounding the sides of the circuit and presenting one or more linear arrays of conductive connectors extending laterally through the rectangular structure. Preferably the rectangular structure also includes transverse contacts. Advantageously the plate includes extensions beyond the rectangular structure for acting as cooling fins on opposing sides of the rectangular structure. The linear arrays and cooling fins are preferably on different pairs of parallel sides.

Title
Integrated circuit package and compact assemblies thereof
Application Number
7/587308
Publication Number
5043794
Application Date
September 24, 1990
Publication Date
August 27, 1991
Inventor
John Thomson Jr
Spring Lake
NJ, US
King L Tai
Berkeley Heights
NJ, US
Agent
Glenn E Books
Assignee
AT&T Bell Laboratories
NJ, US
IPC
H01L 23/32
H01L 23/14
H01L 23/12
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