05039628 is referenced by 60 patents and cites 16 patents.

A substrate for attaching electrical devices having an interconnect wiring structure and a support for the interconnect, the support having a number of vias, or throughholes, extending therethrough and electrically connected to the interconnect. The substrate allows for attachment of the electrical devices on the side of the support opposite the interconnect at the vias, rather than on the interconnect itself. By so doing, the chips can be packed more density since the area between the chips normally reserved for engineering change pads, test pads and the like is not required, these functions being performed on the interconnect on the opposite side of the substrate.

Title
Flip substrate for chip mount
Application Number
157778
Publication Number
5039628
Application Date
February 12, 1990
Publication Date
August 13, 1991
Inventor
David H Carey
Austin
TX, US
Agent
Fulbright & Jaworski
Assignee
Microelectronics & Computer Technology Corporation
TX, US
IPC
H01L 23/16
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