05032896 is referenced by 101 patents and cites 10 patents.

A 3-D IC chip assembly is formed from stacked substrates in which each individual substrate has a plurality of different IC chips retained in respective recesses. Conductive feedthroughs extend through the substrate from the side where the chips are located to the opposite side, with the chips electrically connected to the feedthroughs. An electrical routing network on the opposite side of the substrate from the chips provides desired interconnections between the chips by connecting to the feedthroughs. The routing can be formed by standard photolithographic techniques.

Title
3-D integrated circuit assembly employing discrete chips
Application Number
7/401371
Publication Number
5032896
Application Date
August 31, 1989
Publication Date
July 16, 1991
Inventor
Hugh L Garvin
Malibu
CA, US
Jan Grinberg
Los Angeles
CA, US
Michael J Little
Woodland Hills
CA, US
Agent
W K Denson Low
V D Duraiswamy
Assignee
Hughes Aircraft Company
CA, US
IPC
H01L 29/46
H01L 25/48
H01L 39/02
H01L 23/16
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