05031026 is referenced by 53 patents and cites 15 patents.

The reliability of a thin semiconductor card, such as an IC card, is enhanced by stress absorbing part such as deformable part for absorbing externally applied stress, thereby preventing the stress from damaging the card main body, the semiconductor module, or the semiconductor elements. Alternatively, protection is provided by a weaker section, located away from the semiconductor module, that breaks under external stress before the stress can destroy the semiconductor module.

Title
Thin semiconductor card
Application Number
26873
Publication Number
5031026
Application Date
July 1, 1988
Publication Date
July 9, 1991
Inventor
Tetsuya Ueda
Itami
JP
Agent
Sterne Kessler Goldstein & Fox
Assignee
Mitsubishi Denki Kabushiki Kaisha
JP
IPC
H01L 23/28
H01L 39/02
H01L 23/12
H01L 23/02
View Original Source