05028983 is referenced by 46 patents and cites 16 patents.

Electronic device packaging structures useful for electrically interconnecting an electronic device to a substrate. The structure contains at least two metallization layers with dielectric layers between adjacent to metallization layers. The dielectric layers can have variable thickness. Beam leads can project inwardly in cantilevered fashion over a central aperture through the dielectric layers. The inner ends of the beam leads lie substantially in one plane and can be bonded to contact pads on integrated circuit electronic devices. Beam leads can project outwardly from the metallization layers over outer edges of the dielectric layers for bonding to contact pads on a substrate. Signal leads on metallization layers can be symmetrically arranged between ground and voltage leads to provide optimal impedance properties. These structures are useful for tape automated bonding applications.

Title
Multilevel integrated circuit packaging structures
Application Number
7/263835
Publication Number
5028983
Application Date
October 27, 1988
Publication Date
July 2, 1991
Inventor
Walter V Vilkelis
Poughkeepsie
NY, US
Uh Po E Tsou
Essex Junction
VT, US
Timothy C Reiley
Los Gatos
CA, US
David P Pagnani
Apalachin
NY, US
Leonard T Olson
Centerville
VA, US
Ekkehard F Miersch
Mamaroneck
NY, US
Peter G Ledermann
Pleasantville
NY, US
John Gow III
Milton
VT, US
Thomas M Cipolla
Hopewell Junction
NY, US
Mark F Bregman
Ridgefield
CT, US
Harry R Bickford
Ossining
NY, US
Agent
Daniel P Morris
Assignee
International Business Machines Corporation
NY, US
IPC
H01L 23/48
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