05021733 is referenced by 10 patents and cites 9 patents.

A burn-in apparatus includes burn-in boards for holding semiconductor devices through air suction and for electrically connecting them to external equipment. Since the semiconductor devices are held on the burn-in boards for electrical connection through air suction, sockets are not necessary to hold them on the boards which reduces costs. Further, the leads of semiconductor devices, which have conventionally been susceptible to bending when inserted into or extracted from the sockets, can be protected.

Title
Burn-in apparatus
Application Number
7/463544
Publication Number
5021733
Application Date
January 11, 1990
Publication Date
June 4, 1991
Inventor
Yasuhiko Fukushima
Itami
JP
Sachiko Ebihara
Itami
JP
Agent
Leydig Voit & Mayer
Assignee
Mitsubishi Denki Kabushiki Kaisha
JP
IPC
G01R 1/02
G01R 1/00
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