05020283 is referenced by 163 patents and cites 4 patents.

A polishing pad for semiconductor wafers, having a face shaped by a series of voids. The voids are substantially the same size, but the frequency of the voids increases with increasing radial distance to provide a constant, or nearly constant, surface contact rate to a workpiece such as a semiconductor wafer, in order to effect improved planarity of the workpiece.

Title
Polishing pad with uniform abrasion
Application Number
468348
Publication Number
5020283
Application Date
August 3, 1990
Publication Date
June 4, 1991
Inventor
Mark E Tuttle
Boise
ID, US
Agent
Angus C Fox III
Stanley N Protigal
Assignee
Micron Technology
ID, US
IPC
B24B 7/22
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