05019946 is referenced by 82 patents and cites 9 patents.

Interconnected integrated circuits (16) packaged at a very high density are fabricated beginning with a plurality of substrates (50 or 400 or 500) where each substrate has metal edge contact sites (12 or 507). Several substrates are joined together in a stack (82 or 402 or 512) held together tightly by bolts (62) or by a thermoplastic adhesive (510). An interconnect pattern (250 or 423) electrically connects integrated circuits (16) on different substrates. Defective substrates are removable from the stack for repair by removing the bolts or by heating the adhesive to soften it sufficiently to allow removal of the individual substrate. The interconnect pattern, which is removed whenever a substrate is replaced, is reapplied after the removed substrate has been replaced.

Title
High density interconnect with high volumetric efficiency
Application Number
7/250010
Publication Number
5019946
Application Date
September 27, 1988
Publication Date
May 28, 1991
Inventor
Robert J Wojnarowski
Ballston Lake
NY, US
Charles W Eichelberger
Schenectady
NY, US
Agent
James C Davis Jr
Marvin Snyder
Assignee
General Electric Company
NY, US
IPC
H05K 1/11
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