05016023 is referenced by 133 patents and cites 8 patents.

A hybrid type thermal ink jet (TIJ) pen and method of manufacture wherein a plurality of individual thin film ink jet printheads, each including an orifice plate, are selectively spaced on and secured to an insulating substrate having ink feed ports therein which supply ink to the printheads. Buss lines and integrated circuit driver-decoder packages may be mounted in a planar fashion with respect to the printheads and electrically interconnected to drive the printheads.

Alternatively, the individual printheads may be mounted on a unitary insulating support and ink feed structure such as a ceramic substrate and interconnected to off-substrate TIJ driver circuitry by way of printed or silk-screened electrical leads. These leads may be laid down in a controlled pattern on the surface of the ceramic substrate and used to interconnect bonding pads on the TIJ printheads with the above off-substrate driver circuitry and power supplies. If desired, integrated circuit packages may be mounted in slots cut in the ceramic substrate in a planar arrangement with respect to the printheads.

Title
Large expandable array thermal ink jet pen and method of manufacturing same
Application Number
7/417936
Publication Number
5016023
Application Date
October 6, 1989
Publication Date
May 14, 1991
Inventor
Gary E Hanson
Boise
ID, US
Conrad L Wright
Boise
ID, US
C S Chan
Boise
ID, US
Assignee
Hewlett Packard Company
CA, US
IPC
B41J 2/05
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