05012323 is referenced by 209 patents and cites 2 patents.

A semiconductor package incorporating a pair of semiconductor dice on a single leadframe of the type having a wire-bonding region at each end of a die-attachment region which has both an upper and lower surface. The first of said pair of dice is back bonded to the upper surface of said die-attachment region; the second is face bonded to the lower surface of said die-attachment region. Electrical interconnections between said second die and said leadframe pass through an aperture in the leadframe. The dual-die package can be used to approximately double circuit density in a number of different packages, including a dual inline package (DIP), a small-outline J-lead package (SOJ), a single inline package (SIP), zig-zag inline package (ZIP), and other variations of the single- and double-row inline-lead packages.

Title
Double-die semiconductor package having a back-bonded die and a face-bonded die interconnected on a single leadframe
Application Number
7/439243
Publication Number
5012323
Application Date
November 20, 1989
Publication Date
April 30, 1991
Inventor
Warren M Farnworth
Nampa
ID, US
Agent
Stanley N Protigal
Angus C Fox III
Assignee
Micron Technology
ID, US
IPC
H01L 29/44
H01L 23/48
H01L 39/02
H01L 23/16
View Original Source