05009982 is referenced by 47 patents and cites 7 patents.

A photosetting liquid ink composition developable with a dilute alkaline aqueous solution and comprising (A) a resin curable with an activated energy ray, obtained by the reaction of a saturated or unsaturated polybasic acid anhydride with a product of the reaction of a novolak type epoxy compound and an unsaturated monocarboxylic acid, (B) a photopolymerization initiator, and (C) a diluent can be used for the production of an etching resist or a solder resist in the manufacture of a printed circuit. This composition, when combined with a thermosetting component, produces a photosetting and thermosetting liquid ink composition.

Title
Resist ink composition
Application Number
850220
Publication Number
5009982
Application Date
June 6, 1988
Publication Date
April 23, 1991
Inventor
Syoji Inagaki
Sakado
JP
Yuichi Kamayachi
Wako
JP
Agent
Frost & Jacobs
Assignee
Taiyo Ink Manufacturing
JP
IPC
C08G 59/02
C08L 63/10
G03F 7/032
G03F 7/031
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