05008496 is referenced by 51 patents and cites 4 patents.

A three dimensional printed circuit board having at least two rigid board sections capable of being arranged in different planes and flexibly connected by connecting sections between adjacent board sections is manufactured as a one-piece injection molded part of a thermoplastic molding material. The flexible connecting sections are fashioned as thin regions having a thickness less than the thickness of the rigid board sections. When a semi-crystalline or liquid-crystalline thermoplastic molding material is used, the connecting sections are formed as flexible film hinges, whereas an amorphous thermoplastic molding material results in the connecting sections being bendable only under the influence of heat.

Title
Three-dimensional printed circuit board
Application Number
7/383648
Publication Number
5008496
Application Date
July 24, 1989
Publication Date
April 16, 1991
Inventor
Juergen Bednarz
Penzberg
DE
Siegfried Rauchmaul
Munich
DE
Hans Fr Schmidt
Eurasburg
DE
Agent
Hill Van Santen Steadman & Simpson
Assignee
Siemens Aktiengesellschaft
DE
IPC
H05K 1/00
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