An improved electrical connector for making electrical connections between electronic components. The improved electrical connector includes an insulating board interposed between metalized contact areas on the electronic components. The insulating board has openings at positions corresponding to the contact areas of the electronic components, with electrical connections between the contact areas established with conductive connector elements positioned in the openings of the insulating board. The connector elements are preferably each formed from a strand of metal wire, each strand being wadded together to form a nearly cylindrical "button" of material having a density of between twenty and thirty percent. The improved electrical connector provides high density contact areas, easy engagement and disengagement of the electronic components, and minimum electrical resistance between the contact areas.