05007841 is referenced by 22 patents and cites 14 patents.

An integrated-circuit (IC) chip packaging construction for mounting and interconnecting IC chips and IC chip packages with a multilayer printed circuit board, without soldering, special tooling or special labor, and for interconnecting IC chips with minimized interconnection lead lengths between the IC chips, without cable harnesses or back-panel wiring. The IC chips and IC chip packages are mounted and interconnected using an insulating board having openings through it, and a number of connector elements in the form of compressible wads of conductive wire. The connector elements are disposed in selected openings in the insulating board and compressed into contact with the contact areas on the IC chips and IC chip packages. In a three-dimensional construction employing the principles of the invention, the IC chips are arranged in modules, and interconnections may be made between IC chips within each module, transversely between modules, and in a third direction between layers of modules.

Title
Integrated-circuit chip interconnection system
Application Number
737631
Publication Number
5007841
Application Date
March 3, 1986
Publication Date
April 16, 1991
Inventor
Robert Smolley
Porteuguese Bend
CA, US
Agent
Ronald L Taylor
James M Steinberger
Assignee
TRW
CA, US
IPC
H05K 1/14
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