05001302 is referenced by 50 patents and cites 13 patents.

A connecting structure for an electronic part employs an improved anisotropic electrically conductive layer. The layer includes a hot melt type insulative adhesive, heat resilient particles and carbon particles. Each of the heat resilient particles is made of thermoplastic resin and is plated with metal such as gold, nickel or the like. Each of the carbon particles is melted by a heat pressure and brings about an electric conductivity when it is dried and hardened. Thus, the anisotropically conductive layer disclosed in this invention does not include hard particles at all. Namely, an electronic part such as a solar battery cell or a semiconductor device is not damaged by particles of the conductive layer. In addition, the connecting structure employing the aforementioned layer improves the security of adherence and the reliability of the electric conductivity.

Title
Connecting structure for an electronic part
Application Number
7/436295
Publication Number
5001302
Application Date
November 13, 1989
Publication Date
March 19, 1991
Inventor
Yoshinori Atsumi
Oome
JP
Agent
Frishauf Holtz Goodman & Woodward
Assignee
Casio Computer
JP
IPC
H01R 4/04
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