04998885 is referenced by 172 patents and cites 10 patents.

This invention provides an interposer for electrically connecting two substrates with high density interconnections. The interposer comprises an elastomeric material surrounding fine metal wires which extend through the elastomeric material. The elastomeric material provides mechanical support and electrical isolation for the wires which connect the two opposing surfaces of the interposer with mating substrates. One surface of the interposed has scribes cut into it which mechanically isolate the individual wires. This mechanical isolation between wires reduces the stress placed on the substrates from being connected when the interposer is compressed between the substrates. The support given individual wires by the elastomeric material is controlled, by adjusting the spacing and widths of the scribes, to provide uniform compression across the substrates. Reducing the differentials in compression across the substrates reduces the stress on the substrates and their connections, and therefore, maintains substrate reliability when the substrates are exposed to extended time periods under compression.

Title
Elastomeric area array interposer
Application Number
7/427548
Publication Number
4998885
Application Date
October 27, 1989
Publication Date
March 12, 1991
Inventor
Brian S Beaman
Hyde Park
NY, US
Agent
Maurice H Klitzman
George E Clark
Blaney Harper
Assignee
International Business Machines Corporation
NY, US
IPC
H01R 9/09
View Original Source