04996587 is referenced by 189 patents and cites 2 patents.

A semiconductor package utilizing a carrier with substantially parallel top and bottom surfaces having a recess in the bottom surface and a slot in the top surface communicating with the recess in the bottom surface and provided with electrical conductors on its top surface is provided with an integrated semiconductor chip having a major surface and contact pads on the major surface in the recess of the carrier, with said contact pads positioned in the region of said slot so that the contact pads can be connected by lead wires passing through said slot, to the conductors on the top side of the carrier. The active surface of the chip containing the contact pads is encapsulated but the back surface of the chip and carrier is left exposed to improve the thermal characteristics of the chip while maintaining a low package profile.

Title
Integrated semiconductor chip package
Application Number
7/498134
Publication Number
4996587
Application Date
March 23, 1990
Publication Date
February 26, 1991
Inventor
Richard W Noth
Fairfax
VT, US
Gordon A Kelley Jr
Essex Junction
VT, US
Werner Straehle
Dettenhausen
DE
Kurt Hinrichsmeyer
Sindelfingen
DE
Agent
Francis J Thornton
Assignee
International Business Machines Corporation
NY, US
IPC
H01L 23/12
H01L 23/02
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