04992850 is referenced by 129 patents and cites 4 patents.

A leadframe interconnect package is tape automated bond (TAB) bonded to circuitry on the chip and which provides a circuit connection for subsequent connection to a printed circuit board. The encapsulated chips will replace both the leadframe and printed circuit board (electrical only) as we now know it in the conventional SIMM module.

Title
Directly bonded simm module
Application Number
7/311728
Publication Number
4992850
Application Date
February 15, 1989
Publication Date
February 12, 1991
Inventor
Alan G Wood
Boise
ID, US
Tim J Corbett
Boise
ID, US
Agent
Angus C Fox III
Stanley N Protigal
Assignee
Micron Technology
ID, US
IPC
H01L 27/10
H01L 39/02
H01L 23/16
H01L 23/28
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