04992849 is referenced by 85 patents and cites 4 patents.

A leadframe interconnect package is tape automated bond (TAB) bonded to circuitry on the chip and which provides a circuit connection for subsequent connection to a printed circuit board.

The configuration of integrated circuit chips mounted onto TAB circuitry and then encapsulated permits a variety of cooperative functions to be performed by a single lead attached chip assembly, even though multiple chips are used in the circuit.

Title
Directly bonded board multiple integrated circuit module
Application Number
7/311727
Publication Number
4992849
Application Date
February 15, 1989
Publication Date
February 12, 1991
Inventor
Alan G Wood
Boise
ID, US
Tim J Corbett
Boise
ID, US
Agent
Angus C Fox III
Stanley N Protigal
Assignee
Micron Technology
ID, US
IPC
H01L 27/10
H01L 39/02
H01L 23/16
H01L 23/28
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