04982265 is referenced by 350 patents and cites 6 patents.

In the present invention, memory chips are stuck together in stacked fashion by TAB (tape automated bonding), and a multiple memory chip and lead complex like an SOP (small out-line package) is formed of the chips and leads, whereby a memory module of high packaging density can be realized by a flat packaging technique.

Title
Semiconductor integrated circuit device and method of manufacturing the same
Application Number
7/209739
Publication Number
4982265
Application Date
June 22, 1988
Publication Date
January 1, 1991
Inventor
Yoshiaki Wakashima
Kawasaki
JP
Takashi Ono
Akita
JP
Seiichiro Tsukui
Komoro
JP
Toshio Sugano
Kokubunji
JP
Masayuki Watanabe
Yokohama
JP
Agent
Pennie & Edmonds
Assignee
Akita Electronics
JP
Hitachi Tobu Semiconductor
JP
Hitachi
JP
IPC
H01L 29/60
H01L 29/44
H01L 23/48
H01L 23/16
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