04979134 is referenced by 59 patents and cites 12 patents.

A method for measuring the surface temperature of a wafer substrate and a heat-treating apparatus are both used in a semiconductor device-manufacturing process wherein a reference light including infrared rays is intermittently emitted toward a wafer substrate. Infrared rays of a plurality of different types whose wavelengths are shorter than 1 .mu.m and differ from each other are selectively detected from the reference light emitted toward the wafer substrate, the reference light reflected by the wafer substrate, and the light radiated from the wafer substrate itself. On the basis of the detection performed with respect to the emitted reference light, the reflected reference light and the radiated infrared rays, the surface temperature of the wafer substrate is calculated. A substrate-heating element is controlled on the basis of the calculated temperature.

Title
Method for measuring surface temperature of semiconductor wafer substrate, and heat-treating apparatus
Application Number
7/380026
Publication Number
4979134
Application Date
July 14, 1989
Publication Date
December 18, 1990
Inventor
Hiroki Takebuchi
Kawasaki
JP
Tomonori Narita
Tokyo
JP
Hiroji Tsujimura
Osaka
JP
Jiro Arima
Osaka
JP
Agent
Oblon Spivak McClelland Maier & Neustadt
Assignee
Tokyo Electron
JP
Minolta Camera Kabushiki Kaisha
JP
IPC
G01J 5/00
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