04975763 is referenced by 61 patents and cites 25 patents.

A flat package for semiconductor integrated circuit devices allows edge-mounting and surface-mount. The package may be molded plastic containing a semiconductor chip, and flat leads extend from one edge of the package. The leads are bent to provide an area to solder to conductors on a PC board. Mechanical positioning, mechanical support and spacing are provided by studs extending from the edge of the package adjacent the leads. The studs have stops formed at a position even with flat outer surfaces of the bent leads; the portion outward of the stops fits into holes in the PC board.

Title
Edge-mounted, surface-mount package for semiconductor integrated circuit devices
Application Number
7/168049
Publication Number
4975763
Application Date
March 14, 1988
Publication Date
December 4, 1990
Inventor
Ernest J Russell
Richmond
TX, US
Daniel A Baudouin
Missouri City
TX, US
Agent
Melvin Sharp
N Rhys Merrett
Robby T Holland
Assignee
Texas Instruments Incorporated
TX, US
IPC
H01L 23/50
H05K 7/12
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