04971196 is referenced by 27 patents and cites 34 patents.

In surface packaging of thin resin packages such as resin molded memory ICs or the like, cracks of the package occur frequently at a solder reflow step where thermal impact is applied to the package because the resin has absorbed moisture before packaging. To solve this problem, the devices are packaged moisture-tight at an assembly step of the resin molded devices where the resin is still dry, and are taken out from the bags immediately before the execution of surface packaging.

Title
Surface package type semiconductor package
Application Number
124925
Publication Number
4971196
Application Date
August 10, 1989
Publication Date
November 20, 1990
Inventor
Kunihiko Nishi
Kokubunji
JP
Gen Murakami
Machida
JP
Wahei Kitamura
Kodaira
JP
Agent
Antonelli Terry & Wands
Assignee
Hitachi
JP
IPC
B65D 73/02
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