04967262 is referenced by 50 patents and cites 9 patents.

A semiconductor package having a gull-wing, zig-zag, inline-lead configuration and end-of-package anchoring devices for rigidly affixing the package to a circuit board such that each lead is in compressibe contact with its associated mounting pad on the board. The anchoring devices of a first embodiment comprise anchoring pins having fish-hook-type barbs which lock against the under side of the board when the pegs are inserted through holes in the board; a second embodiment utilizes anchoring pins which are adhesively bonded in recesses that have been drilled or molded into the board; a third embodiment utilizes anchoring pins, the ends of which can be bonded directly to planar peg-bonding regions on the surface of the board; and a fourth utilizes tapered anchoring ping which may be inserted with an interference fit into holes in the board. The invention eliminates the need for mechanical support of the packages during solder reflow operations used during board assembly and repair.

Title
Gull-wing zig-zag inline lead package having end-of-package anchoring pins
Application Number
7/432598
Publication Number
4967262
Application Date
November 6, 1989
Publication Date
October 30, 1990
Inventor
Warren M Farnsworth
Nampa
ID, US
Agent
Stanley N Protigal
Angus C Fox
Assignee
Micron Technology
ID, US
IPC
H01L 23/44
H01L 23/42
H01L 23/16
H01L 39/02
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