04956746 is referenced by 55 patents and cites 7 patents.

The electronic package (10) is comprised of a plurality of support plates (12-24), each of which has a plenum therein and preferably webs extending into the plenum for fluid flow control and heat transfer. A wafer (104) is mounted in a recess (100) in the support plate (12) so that fluid in the plenum (52) directly cools the wafer. Electrical connection is by flexible cable (108) to an exterior printed wiring board (40). The package may have any selected number of support plates, and each support plate may carry one full-sized wafer for compact packaging.

Title
Stacked wafer electronic package
Application Number
7/329991
Publication Number
4956746
Application Date
March 29, 1989
Publication Date
September 11, 1990
Inventor
Charles A Finnila
Manhattan Beach
CA, US
Louis E Gates Jr
Westlake Village
CA, US
Agent
Wanda K Denson Low
Leonard A Alkov
Assignee
Hughes Aircraft Company
CA, US
IPC
H05K 7/20
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