04956694 is referenced by 287 patents and cites 5 patents.

A device for increasing the density of integrated circuit chips on a printed circuit board. A plurality of integrated circuits are packaged within chip carriers and stacked, on one top of the other, on a printed circuit board. Each of the input/output data terminals, power and ground terminals of the chips are connected in parallel. Each chip is individually accessed by selectively enabling the desired chip.

Title
Integrated circuit chip stacking
Application Number
7/267223
Publication Number
4956694
Application Date
November 4, 1988
Publication Date
September 11, 1990
Inventor
Floyd Eide
Huntington Beach
CA, US
Agent
Spensley Horn Jubas & Lubitz
Assignee
Dense Pac Microsystems
CA, US
IPC
H01L 23/02
View Original Source