04954875 is referenced by 151 patents and cites 28 patents.

A semiconductor wafer array comprising a plurality of wafers of semiconductor material. Each of the wafers is provided with cone-shaped or pyramid-shaped vias. Inserted in each of the vias is a correspondingly shaped wad of electrically conductive compliant material for forming continuous vertical electrical connections between the wafers in the stack. The base of each wad makes connection to a bonding pad on the surface of a lower wafer as well as to the electrically conductive compliant material in the lower wafer.

Title
Semiconductor wafer array with electrically conductive compliant material
Application Number
6887129
Publication Number
4954875
Application Date
October 28, 1987
Publication Date
September 4, 1990
Inventor
Ken Clements
Santa Cruz
CA, US
Agent
Fliesler Dubb Meyer & Lovejoy
Assignee
Laser Dynamics
CA, US
IPC
H01L 23/16
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