04954308 is referenced by 47 patents and cites 13 patents.

A resin encapsulating method includes the steps of mounting a plate having a gate groove on a substrate to form a side gate, connected to the side surface of a cavity, between the plate and one of the upper and lower half molds, and filling a resin in the cavity.

Title
Resin encapsulating method
Application Number
7/290227
Publication Number
4954308
Application Date
December 27, 1988
Publication Date
September 4, 1990
Inventor
Hiroyuki Kaneko
Hoya
JP
Katsuji Komatsu
Kawagoe
JP
Isao Yabe
Tokorozawa
JP
Agent
Townsend and Townsend
Assignee
Citizen Watch
JP
IPC
B29C 45/14
B29C 45/02
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