04943516 is referenced by 49 patents and cites 15 patents.

A photosensitive thermosetting resin composition, comprising (A) a photosensitive prepolymer containing at least two ethylenically unsaturated bonds in the molecular unit thereof, (B) a photoinitiator, (C) a photopolymerizable vinyl monomer and/or an organic solvent as a diluent, (D) a finely powdered epoxy compound containing at least two epoxy groups in the molecular unit thereof and exhibiting sparing solubility in the diluent to be used, and optionally (E) a curing agent for epoxy resin, excels in developing property and sensitivity and enjoys a long shelf life.

By subjecting this photosensitive thermosetting resin composition to coating, exposure, development, and postcuring, there can be formed a solder resist pattern which excels in adhesion, insulation resistance, resistance to electrolytic corrosion, resistance to soldering temperature, resistance to chemicals, and resistance to plating.

Title
Photosensitive thermosetting resin composition and method of forming solder resist pattern by use thereof
Application Number
7/274966
Publication Number
4943516
Application Date
November 22, 1988
Publication Date
July 24, 1990
Inventor
Shoji Inagaki
Saitama
JP
Morio Suzuki
Saitama
JP
Kenji Sawazaki
Saitama
JP
Yuichi Kamayachi
Saitama
JP
Agent
Ronald P Kananen
Assignee
Taiyo Ink Manufacturing
JP
IPC
G03C 1/72
G03F 7/027
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