04933259 is referenced by 14 patents and cites 14 patents.

A composition useful as an alkaline developable liquid photoimageable solder resist ink comprising a photocurable resin, a photopolymerization initiator, a reactive diluent, a solvent and optionally, a thermosetting material as main components wherein the photocurable resin comprises a reaction product of: (A) an epoxy vinyl ester resin obtained by reacting a cresol novolak epoxy resin and an unsaturated monobasic acid, (B) a polybasic acid anhydride and (C) an alkyl ketene dimer, wherein the hydroxyl value of the photocurable resin is not more than 10 carbons. Coating films formed from the subject composition have excellent adhesion, heat resistance, moisture insulation resistance and alkaline developable properties.

Title
Alkaline developable liquid photoimageable solder resist ink composition
Application Number
7/236089
Publication Number
4933259
Application Date
August 24, 1988
Publication Date
June 12, 1990
Inventor
Mitsukazu Funahashi
Osaka
JP
Machio Chihara
Osaka
JP
Agent
Pennie & Edmonds
Assignee
Arakawa Chemical
JP
IPC
G03C 1/68
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