04933042 is referenced by 84 patents and cites 21 patents.

A method and apparatus are provided for disposing a polymer film on an irregularly-shaped substrate at relatively high temperatures. In particular, the method and apparatus of the present invention provide a system for the packaging of very large scale intergrated circuit chips. The system of the present invention particularly solves problems associated with high temperature processing and problems associated with the highly irregular surfaces that result. Nonetheless, the resultant product is capable of being fashioned into circuit chip systems which are independently testable and which may be reconfigured after testing by removal of the polymer film itself.

Title
Method for packaging integrated circuit chips employing a polymer film overlay layer
Application Number
912458
Publication Number
4933042
Application Date
August 30, 1988
Publication Date
June 12, 1990
Inventor
Kenneth B Welles II
Schenectady
NY, US
Robert J Wojnarowski
Ballston Lake
NY, US
Charles W Eichelberger
Schenectady
NY, US
Agent
Marvin Snyder
James C Davis Jr
Robert Ochis
Assignee
General Electric Company
NY, US
IPC
B44C 1/20
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