04925773 is referenced by 12 patents and cites 9 patents.

A solder resist ink composition is disclosed which contains a photo-curable resin obtained by causing an unsaturated monocarboxylic acid to react with a cresolnovolak- or phenolnovolak-type epoxy resin, and causing a polybasic carboxylic anhydride to react with the resultant reaction product, a photo-curable resin obtained by causing an unsaturated monocarboxylic acid to react with a bisphenol A novolak- or cycloaliphatic oxirane novolak-type opoxy resin, and causing a polybasic carboxylic anhydride to react with the resultant reaction product, at least one photo-polymerizable compound selected from photo-polymerizable monomers, a photo-polymerization initiator, an organic solvent, and an inorganic filler. Also disclosed are two other solder resist ink compositions each having a different photo-curable component.

Title
Solder resist ink composition
Application Number
7/135049
Publication Number
4925773
Application Date
December 18, 1987
Publication Date
May 15, 1990
Inventor
Teiji Kohara
Kawasaki
JP
Yuji Nakaizumi
Tokyo
JP
Kazuhiro Takeda
Higashine
JP
Yuusuke Wada
Tokyo
JP
Masataka Miyamura
Kamakura
JP
Agent
Oblon Spivak McClelland Maier & Neustadt
Assignee
Kabushiki Kaisha Toshiba
JP
IPC
G03C 1/68
C08G 8/32
C08G 8/30
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