04914551 is referenced by 111 patents and cites 12 patents.

An electronic package (10) including a first circuitized substrate 11 (e.g., printed circuit board) having connected thereto a second, flexible circuitized substrate (e.g., polyimide with chrome-copper-chrome circuitry thereon). The second substrate is in turn electrically connected to the invention's semiconductor device (e.g., silicon chip), which device in turn is attached to a heat spreader (37) for providing effective heat transference from the device to the package's heat sink (33). The heat sink is attached to the first substrate (e.g., using solder). Significantly, the coefficients of thermal expansion of the heat spreader, semiconductor device and adhesive used to connect same are substantially similar, around 2 to 5 ppm/degree Kelvin (.times.10.sup.-6 m/m degrees Kelvin), in order to provide an effective heat path from the heat-generating device to the corresponding, much larger heat sink.

Title
Electronic package with heat spreader member
Application Number
7/218725
Publication Number
4914551
Application Date
July 13, 1988
Publication Date
April 3, 1990
Inventor
Bahgat G Sammakia
Johnson City
NY, US
Morris Anschel
Binghamton
NY, US
Agent
Lawrence R Fraley
Assignee
International Business Machines Corporation
NY, US
IPC
H02B 1/00
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