04897708 is referenced by 222 patents and cites 16 patents.

A wafer array comprising a plurality of wafers of semiconductor material are stacked one on top of another. Through holes are provided in the wafers and electrically conductive liquid is inserted in the through holes for interconnecting all of the wafers. The conductive liquid is electrically insulated from all parts of the wafers except a part comprising an electrically conductive bonding pad which provides an electrical path between the conductive liquid and transistors located in the wafers. The wafers, which are disposed in a stack one on top of the other, are mounted in an enclosure and coupled to electrical pin members for connection to external devices.

Title
Semiconductor wafer array
Application Number
6/887129
Publication Number
4897708
Application Date
July 17, 1986
Publication Date
January 30, 1990
Inventor
Ken Clements
Santa Cruz
CA, US
Agent
Fliesler Dubb Meyer & Lovejoy
Assignee
Laser Dynamics
CA, US
IPC
H01L 23/52
H01L 23/48
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