04893172 is referenced by 178 patents and cites 2 patents.

Disclosed is a connecting structure for electrically connecting an electronic part such as an LSI chip to a substrate and a method of manufacturing the same. The present invention is suitable especially for electrical connection between a plurality of chips and a substrate which is required to have a function of absorbing a difference in thermal expansion in the horizontal direction and to deform in the vertical direction, and characterized in that a conductive flat spring having a height not more than the minimum length in the lateral direction is provided between the electronic part such as a chip and a wires substrate.

Title
Connecting structure for electronic part and method of manufacturing the same
Application Number
7/143200
Publication Number
4893172
Application Date
January 13, 1988
Publication Date
January 9, 1990
Inventor
Suguru Sakaguchi
Chigasaki
JP
Muneo Oshima
Yokohama
JP
Kunio Matsumoto
Yokohama
JP
Agent
Fay Sharpe Beall Fagan Minnich & McKee
Assignee
Hitachi
JP
IPC
H01L 21/603
H01L 23/48
H01L 23/36
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