04880684 is referenced by 56 patents and cites 10 patents.

Sealing and stress relief are provided to a low-fracture strength glass-ceramic substrate. Hermeticity is addressed through the use of capture pads in alignment with vias and through polymer overlays with interconnection between the underlying via or pad metallurgy and the device, chip, wire or pin bonded to the surface of the layer. Multilevel structures are taught along with a self-aligned sealing and wiring process.

Title
Sealing and stress relief layers and use thereof
Application Number
7/167290
Publication Number
4880684
Application Date
March 11, 1988
Publication Date
November 14, 1989
Inventor
Da Yuan Shih
Poughkeepsie
NY, US
John A Romano
Hopewell Junction
NY, US
Paul H Palmateer
Wappingers Falls
NY, US
Robert H Massey
Wappingers Falls
NY, US
Walter F Lange
Longmont
CO, US
Amanda H Kumar
Hopewell Junction
NY, US
Carl P Hayunga
Poughkeepsie
NY, US
Warren D Grobman
Carmel
NY, US
George M Greenstein
Hopewell Junction
NY, US
Derry J Dubetsky
Wappingers Falls
NY, US
Timothy W Carr
Hopewell Junction
NY, US
David W Boss
Beacon
NY, US
Agent
Ira D Blecker
Anne V Dougherty
Assignee
International Business Machines Corporation
NY, US
IPC
B29C 37/00
B44C 1/22
B32B 7/00
B32B 3/00
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