04879588 is referenced by 31 patents and cites 8 patents.

An improved integrated circuit package of the MLCP type suitable for use both at high operating frequencies and with chips dissipating large amounts of power. Electric power supplying wirings and signal transmitting wirings are disposed on entirely separate surfaces, the power transmitting wirings being formed on entire peripheries of respective, dedicated ceramic plates. Termination resistors for the signal wirings though are formed on the same ceramic plates which contain the power supplying wirings.

Title
Integrated circuit package
Application Number
7/145068
Publication Number
4879588
Application Date
January 19, 1988
Publication Date
November 7, 1989
Inventor
Masao Ida
Tokyo
JP
Tomoji Goto
Hyogo
JP
Akira Ohtsuka
Hyogo
JP
Agent
Cushman Darby & Cushman
Assignee
Nippon Telegraph and Telephone Corporation
JP
Sumitomo Electric
JP
IPC
H01L 39/02
H01L 29/60
H01L 29/44
H01L 23/48
View Original Source