04878611 is referenced by 218 patents and cites 8 patents.

A solder joint assembly technique applies controlled volumes of solder to pads of both package and substrate. The two units are positioned adjacent each other with the pads and solder deposits mechanically maintained in registration with each other. The assembly is reflowed and the final separation between package and substrate at which the resulting solder joint solidifies is mechanically controlled in order to control a geometry of the resultant solidified joint. The solder volume deposits may assume various forms including spherical bumps and solder paste deposits.

Title
Process for controlling solder joint geometry when surface mounting a leadless integrated circuit package on a substrate
Application Number
868988
Publication Number
4878611
Application Date
June 9, 1988
Publication Date
November 7, 1989
Inventor
Michael A Oien
Chatham Township, both of Morris County
NJ, US
Francis LoVasco
Roxbury Township
NJ, US
Agent
Alfred G Steinmetz
Assignee
American Telephone and Telegraph Company AT&T Bell Laboratories
NJ, US
IPC
B23K 31/02
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