04871417 is referenced by 97 patents and cites 12 patents.

A method for surface treating of thin substrates such as semiconductor wafers, wherein a semiconductor wafer formed with relatively deep but transversely minute trenches on its surface is horizontally placed on a spinner in a chamber with its trenched surface directed up, ultraviolet light is then emitted onto the surface of the wafer to dissolve impurities sticking in the trenches, and thereafter etchant is spouted from a nozzle to the trenched surface of the wafer being spinned about a vertical axis at a high speed. Next, the inside of the chamber is subjected to a lower pressure than atmospheric pressure, and atmospheric pressure is restored after the lapse of a predetermined time. Thus a series of these steps of etchant supplying, pressure reducing, and pressure recovering are carried out until the complete entrance of the etchant into the interior surfaces of the trenches is effected, so as to even or smooth the interior surfaces and, finally the wafer is treated with rinsing, heating and drying steps.

Title
Method and apparatus for surface treating of substrates
Application Number
7/69541
Publication Number
4871417
Application Date
June 30, 1987
Publication Date
October 3, 1989
Inventor
Masato Tanaka
Nagahama
JP
Masaru Morita
Minami
JP
Hisao Nishizawa
Shiga
JP
Agent
Lowe Price LeBlanc Becker & Shur
Assignee
Dainippon Screen Mfg
JP
IPC
B08B 3/10
H01L 21/306
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