A high density, high performance and high fidelity connector system that can connect between electronic circuit planes having different wiring densities. The connector has a modular structure that avoids tolerance build-up for large (long) connections between two substrates, or between a substrate and a board. The connector design can accommodate differential temperature coefficients of expansion between the connector materials and the materials of the substrates being connected. The connector can be formed from low cost printed circuit board technology, or its equivalent, and can be configured to have controlled impedance, low crosstalk and wide bandwidth. The angle between surfaces being interconnected can vary from 0 to 360 degrees.