04862245 is referenced by 453 patents and cites 3 patents.

The present invention is directed to a packaged semiconductor chip which effectively dissipates heat and has improved performance. The packaged chip has a plurality of lead frame conductors extending through the encapsulating material which are adhesively joined to the semiconductor chip, preferably by means of an alpha barrier. The conductors cover a substantial portion of the surface of the chip and thereby serve as conduits for the dissipation of heat from the chip. Wires are bonded to the conductors and extend from the conductors to the terminals on the semiconductor chip. In a preferred embodiment the semiconductor chip terminals are located along a center line of the chip. This allows for short connecting wires which in turn contribute to faster chip response.

Title
Package semiconductor chip
Application Number
724736
Publication Number
4862245
Application Date
February 19, 1988
Publication Date
August 29, 1989
Inventor
William C Ward
Burlington
VT, US
Sigvart J Samuelsen
Burlington
VT, US
Douglas W Phelps Jr
Burlington
VT, US
Richard P Pashby
Williston
VT, US
Agent
Michael J Weins
Theodore E Galanthay
Francis J Thornton
Assignee
International Business Machines Corporation
NY, US
IPC
H01L 23/48
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