04858071 is referenced by 57 patents and cites 4 patents.

A flexible printed circuit substrate is bent in a flattened rectangular C-shape and electronic parts generating heat are mounted on the inner surface of a central portion of the C-shaped substrate. Then a radiating heat-sink plate is adhered on the outer surface of that central portion. Temperature-sensitive electronic parts are mounted on one end portion of the C-shaped substrate and parts consisting of a power supply circuit are mounted on the other end portion. Then the entire assembly is accommodated in a housing having a connector.

Title
Electronic circuit apparatus
Application Number
7/159098
Publication Number
4858071
Application Date
February 23, 1988
Publication Date
August 15, 1989
Inventor
Hiroyuki Nomura
Fujisawa
JP
Yasuhito Osada
Katano
JP
Mikio Nozu
Yamatokouriyama
JP
Takahiro Manabe
Katano
JP
Agent
Cushman Darby & Cushman
Assignee
Matsushita Electric Industrial
JP
Nissan Motor
JP
IPC
H05K 7/20
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