04845426 is referenced by 92 patents and cites 2 patents.

A prober for the electrical testing of unpackaged integrated circuits on a semiconductor wafer can test these devices between subfreezing to elevated temperatures without generating atmospheric fog or frost on the wafer or associated equipment by directing an enclosed tubular curtain of dry gas, such as heated liquid nitrogen, down from a circular nozzle above the wafer to encircle the device under test. Observations can be made and electrical tests performed within the curtain while all moist atmospheric air is purged from the wafer and surrounding areas so that fog and frost cannot form.

Title
Temperature conditioner for tests of unpackaged semiconductors
Application Number
7/51705
Publication Number
4845426
Application Date
May 20, 1987
Publication Date
July 4, 1989
Inventor
Stuart Sahr
Wickenburg
AZ, US
Charles C Nolan
Sunnyvale
CA, US
Agent
Linval B Castle
Assignee
Signatone Corporation
CA, US
IPC
G01R 31/26
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