Drilling apparatus and method United States Patent 04839497

04839497 is referenced by 33 patents and cites 9 patents.

An apparatus and method for drilling holes in printed wiring boards formed of a plurality materials wherein two or more laser beams are combined along a common path and preferably focussed on the desired drilling site. The wavelengths of the lasers are selected such that they are each rapidly absorbed and therefor vaporized at least one of said materials. The laser beams are preferably focussed by a beam combining mirror. The lasers can be controlled to provide simultaneous or sequential emission of the laser beams.

Title
Drilling apparatus and method
Application Number
7/92558
Publication Number
4839497
Application Date
September 3, 1987
Publication Date
June 13, 1989
Inventor
George A Zahaykevich
Watertown
MA, US
Victor T Pileeki
Townsend
MA, US
Nott G Sankar
Andover
MA, US
Agent
Kenyon & Kenyon
Assignee
Advanced Laser Systems
MA, US
Digital Equipment Corporation
MA, US
IPC
B23K 26/00
View Original Source

Citations: 33 (view full list)

  1. Hideho Inagawa, Shigenobu Nojo: Method and apparatus for working print board by laser. Canon Kabushiki Kaisha, Fitzpatrick Cella Harper & Scinto, December 17, 1991: US05073687 (53 worldwide citation)
  2. Steven A Cordes, Peter Alfred Gruber, Egon Max Kummer, Stephen Roux, Carlos Juan Sambucetti, James Louis Speidell: Etched glass solder bump transfer for flip chip integrated circuit devices. International Business Machines Corporation, David P Morris, Alvin J Riddles, December 25, 2001: US06332569 (49 worldwide citation)
  3. Russell T White Jr: Apparatus and method for multi-beam drilling. International Business Machines Corporation, Pollock Vande Sande & Priddy, November 22, 1994: US05367143 (32 worldwide citation)
  4. Steven A Cordes, Peter Alfred Gruber, Egon Max Kummer, Stephen Roux, Carlos Juan Sambucetti, James Louis Speidell: Etched glass solder bump transfer for flip chip integrated circuit devices. International Business Machines Corporation, Daniel P Morris, Alvin J Riddles, August 22, 2000: US06105852 (28 worldwide citation)
  5. David B Noddin: Multiple pulse space processing to enhance via entrance formation at 355 nm. W L Gore & Associates, Victor M Genco Jr, November 24, 1998: US05841102 (24 worldwide citation)
  6. E Michael Ackley Jr, Daniel J Palmer: Laser system for pellet-shaped articles. Ackley Machine Corporation, Nixon & Vanderhye P C, November 25, 2008: US07456946 (23 worldwide citation)
  7. Robert C Marrs, Tadashi Hirakawa: Method for forming an integrated circuit package with via interconnection. Amkor Electronics, Teijin, Skjerven Morrill MacPherson Franklin & Friel, January 3, 1995: US05378869 (22 worldwide citation)
  8. Robert C Marrs, Tadashi Hirakawa: Integrated circuit package with via interconnections formed in a substrate. Amkor Electronics, Teijin, Skjerven Morrill MacPherson Franklin & Friel, January 9, 1996: US05483100 (20 worldwide citation)
  9. Hideho Inagawa, Shigenobu Nojo: Apparatus and method of boring using laser. Canon Kabushiki Kaisha, Fitzpatrick Cella Harper & Scinto, June 30, 1992: US05126532 (20 worldwide citation)
  10. Hideho Inagawa, Shigenobu Nojo: Apparatus and method of boring using laser. Canon Kabushiki Kaisha, Fitzpatrick Cella Harper & Scinto, November 24, 1992: US05166493 (19 worldwide citation)

References: 9

  1. Yoshitake Oka, Tetsuo Ishihara, Masane Suzuki, Motonori Kanaya: Method for cutting specific layer of synthetic resin laminated film. Daicel Chemical, Blanchard Flynn Thiel Boutell & Tanis, April 6, 1982: US04323757 (11 worldwide citation)
  2. John B Pardee: Semiconductor laser processing with mirror mask. Eaton Corporation, Andrus Sceales Starke & Sawall, April 28, 1987: US04661679 (11 worldwide citation)
  3. Yoshihide Kimbara: Dual-polarization, dual-frequency cutting machine. Mitsubishi Denki Kabushiki Kaisha, Sughrue Mion Zinn Macpeak and Seas, November 17, 1987: US04707584 (18 worldwide citation)
  4. Emmanuel Lambert, Jean Louis Lambert, Bernard De Longueville: Severing of glass or vitrocrystalline bodies. Glaverbel Mecaniver, Spencer & Kaye, January 27, 1976: US03935419 (30 worldwide citation)
  5. John W Sliwa Jr: Interfacial blister bonding for microinterconnections. Xerox Corporation, Serge Abend, August 13, 1985: US04535219 (35 worldwide citation)
  6. Willy Verheyen, Andre Raes, Jean Paul Coopmans, Jean Louis Lambert: Glass cutting. Glaverbel Mecaniver, Spencer & Kaye, January 13, 1976: US03932726 (38 worldwide citation)
  7. Tohru Nakajima: Laser knife device. Asahi Kogaku Kogyo Kabushiki Kaisha, Sughrue Mion Zinn Macpeak and Seas, October 11, 1983: US04408602 (56 worldwide citation)
  8. William M Steen: Methods and apparatus for cutting and welding. National Research Development Corporation, Oblon Fisher Spivak McClelland & Maier, September 11, 1979: US04167662 (65 worldwide citation)
  9. July, 1965: US3453097