04835704 is referenced by 109 patents and cites 24 patents.

An adaptive method and system are disclosed for providing high density interconnections of very large scale integrated circuits on a substrate. The procedure is performed in four basic steps: first an artwork representation for the interconnections of the integrated circuits is generated. This artwork representation is stored in a computer data base and assumes the integrated circuits to be at predetermined ideal locations and positions on the substrate. Second, using imaging, the actual positions of each integrated circuit on the substrate are determined. The actual positions of the integrated circuits are compared with their ideal positions to compute an offset and rotation for each integrated circuit on the substrate. Third, the computed offsets and rotations are then used to modify the artwork representation stored in the data base to account for the actual locations and positions of the integrated circuits on the substrate. Finally, the modified artwork representation is used to drive a direct writing laser lithography system that actually forms the high density interconnections of the integrated circuits on the substrate. The artwork representations are stored in computer data bases in vector form to minimize storage requirements. The laser beam produced by the lithography system is raster scanned on the substrate. Modulation of the laser beam is controlled by the real time conversion of the vector representation of the modified artwork to be a bit mapped representation. To assure accurate formations of the interconnects, a feedback alignment system is used to accurately position the laser beam throughout its raster scan.

Title
Adaptive lithography system to provide high density interconnect
Application Number
6/947461
Publication Number
4835704
Application Date
December 29, 1986
Publication Date
May 30, 1989
Inventor
Kenneth B Welles II
Schenectady
NY, US
Robert J Wojnarowski
Ballston Lake
NY, US
Charles W Eichelberger
Schenectady
NY, US
Agent
Marvin Snyder
James C Davis Jr
Robert Ochis
Assignee
General Electric Company
NY, US
IPC
G06F 15/60
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