04827211 is referenced by 123 patents and cites 5 patents.

A wafer probe for accessing bonding pads on a planar device includes contact pads mounted on one edge of the under side of a dielectric substrate board and arranged to align with the bonding pads to be accessed. Coplanar ground and signal conductors deposited on the under side of the substrate board form constant impedance transmission lines for connecting test equipment to the contact pads. A ground contact is mounted on the upper side of the substrate near the end on which the contact pads are mounted, the ground contact being connected by a conductive path to the ground conductors on the under side of the substrate. When two such wafer probes simultaneously access bonding pads on the same planar device, the ground conductors of the two probes are interconnected by a conductive sheet of foil extending between the ground contacts on the upper sides of the substrates of both wafer probes.

Title
Wafer probe
Application Number
7/8847
Publication Number
4827211
Application Date
January 30, 1987
Publication Date
May 2, 1989
Inventor
Kimberly R Gleason
Portland
OR, US
Eric W Strid
Portland
OR, US
Agent
Dellett Smith Hill and Bedell
Assignee
Cascade Microtech
OR, US
IPC
G01R 31/02
G01R 1/06
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