04813129 is referenced by 86 patents and cites 6 patents.

An interconnect structure for electrically coupling conductive paths on two adjacent, rigid substrates, such as PC boards or IC chips. The interconnect structure includes a number of buttons formed on a first substrate, and a number of contacts formed on a second substrate. The buttons are elastically deformable, and include a resilient core made from an organic material such as polyimide, and a metallic coating formed over the core. The two substrates are compressed between mounting plates such that the buttons are pressed against the contracts to make electrical contact.

Title
Interconnect structure for PC boards and integrated circuits
Application Number
7/64411
Publication Number
4813129
Application Date
June 19, 1987
Publication Date
March 21, 1989
Inventor
Marcos Karnezos
Palo Alto
CA, US
Agent
Paul L Hickman
Assignee
Hewlett Packard Company
CA, US
IPC
H01R 9/09
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