04811081 is referenced by 104 patents and cites 4 patents.

An improved semiconductor assembly includes a semiconductor die that is mounted on a carrier, such as a tape or a substrate, by means of an anisotropically electrically conductive adhesive. The adhesive forms an electrically conductive path between electrical conductors on the carrier and other conductors on the die so that the die can be probe tested before the adhesive is cured and before the die is permanently bonded to the carrier.

Title
Semiconductor die bonding with conductive adhesive
Application Number
7/29294
Publication Number
4811081
Application Date
March 23, 1987
Publication Date
March 7, 1989
Inventor
Thomas B Lyden
Schaumburg
IL, US
Agent
John H Moore
Assignee
Motorola
IL, US
IPC
H01L 23/14
H01L 23/10
H01L 23/12
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